As the Chairman of the program’s committee, and together with scientific conference host, Prof. Dr. Matthias Nowottnick from the University of Rostock, he welcomed numerous experts to the two-day event in the Schwabenlandhalle, Fellbach, Germany. VDE/VDI - Society of Microelectronics, Microsystems and Precision Engineering (GMM) and DVS, German Welding Society sent out invitations to the conference.
Progressing digitalization in all areas of life, the establishment of 5G mobile phone networks and artificial intelligence cannot be realized without a suitable technological platform. Therefore electronic assemblies and PCBs need to quickly further develop in order to be able to provide the higher frequencies, voltages and power density needed in the face of increasing miniaturization and the additional integration of functions. But that alone is not enough: the assemblies should also be robust, reliable and inexpensive. The declared goal of the conference was to find new approaches to the solutions to these challenges and to advance progressive know-how in Europe.