| Specification | Options |
|---|---|
| IPC class | IPC A 600 class 2 |
| min PCB size (raw pcb) | 30 mm x 15 mm |
| min panel size (production) | 100 mm x 100 mm |
| max PCB size (raw pcb) | 426 mm x 271 mm |
| max panel size (production) | 450 mm x 400 mm |
| Surrounding panel border | 10 mm |
| PCB material | TG 150 |
| Number of layers: | 1–16 layers |
| PCB thickness | 0,50 / 0,80 / 1,00 / 1,55 / 2,00 / 2,40 / 3,20 mm |
| Outer/inner layer structures: | ≥ 250 µm (necessary for 105 µm) ≥ 192 µm (necessary for 70 µm) ≥ 150 µm ≥ 125 µm ≥ 100 µm (not IPC compliant) ≥ 85 µm (only with 18 µm End CU) |
| Final copper, exterior/interior: | 18 µm (no galv. metalization) 35 µm / 70 µm / 105 µm |
| Smallest VIA: | ≥ 0,25 mm (Pad ≥ 0,60 mm) ≥ 0,10 mm (Pad ≥ 0,45 mm) |
| Smallest milling diameter: | ≥ 1,60 mm ≤ 1,50 mm und ≥ 1,10 mm ≤ 1,00 mm und ≥ 0,50 mm |
| Laser drill holes (micro vias): | no |
| Blind vias: | optional |
| Chamfers: | yes (20° und 45°) |
| Edge metalization: | optional |
| Surface | chem. nickel / gold HAL lead-free chem. tin (Sn) |
| Selektiv galv. Gold with connection | optional |
| Solder resist film: | green |
| Full bleed color print (alternative): | white, yellow, red, blue, black |
| Printed lettering (partial): | white, yellow, red, blue, black |
| Plugged Vias | optional |
| E-testing | optional |
| UL marking | optional |
| Delivery provision: | CoC, if desired |
Deviating specifications upon request!