| Specification | Possibilities |
|---|---|
| IPC class | IPC A 600 Class 2, IPC A 600 Class 3 |
| min PCB size (raw pcb) | 30 mm x 15 mm |
| min panel size (production) | 110 mm x 110 mm |
| max PCB size (raw pcb) | 426 mm x 271 mm |
| max panel size (production) | 450 mm x 400 mm |
| Surrounding panel border | optional |
| Printed circuit board material | TG 150, TG 170 |
| Number of layers | 1 – 24 layers |
| Circuit board thicknesses | 0.50 / 0.80 / 1.00 / 1.55 / 2.00 / 2.40 / 3.20 mm |
| Structures Exterior/Interior Layers | ≥ 250µm (necessary for 105µm) ≥ 192µm (necessary for 70µm) ≥ 150µm ≥ 125µm ≥ 100µm (not IPC compliant) ≥ 85µm (only with 18µm end CU) |
| End copper outside/inside | 18µm (no galvanic metallization) 35µm / 70µm / 105µm |
| Smallest VIA | ≥ 0.25mm (Pad ≥ 0.60mm) ≥ 0.10mm (Pad ≥ 0.45mm) |
| Smallest milling diameter | ≥ 1.60mm ≤ 1.50mm and ≥ 1.10mm ≤ 1.00mm and ≥ 0.50mm |
| Laser drilling (micro via) | no |
| blind holes (blind via) | optional |
| Chamfering | yes (20° and 45°) |
| Edge metallization | optional |
| Surface | chem. Nickel/Gold HAL lead-free chem. Tin (Sn) |
| Selective electroplated gold with connection | optional |
| Solder resist | green |
| Full color printing (alternative) | white, yellow, red, blue, black |
| Lettering printing (partial) | white, yellow, red, blue, black |
| Plugged Via | optional |
| E-Test | standard |
| UL marked | standard |
| Delivery provision | CoC, FAR |