Analysis and Materials Technology

Find out more about our analysis methods

Analysis and Materials Technology – Quality Scrutinized

The area of Analysis and Materials Technology plays a significant role at Zollner Its application is ever more present, particularly in the development phase or in the case of product changes, but also within the framework of product qualification. We offer a broad spectrum in this area and with that provide special added value to our customers. Analyses can be integrated into manufacturing processes or the component supply chain on short notice.

Additional services: Analysis of defects, audit execution, safety releases, standards and patent research, inspection equipment monitoring and preventative tools.

These are some of our analysis methods and laboratory equipment:

  • Scanning electron microscope (SEM) with EDS
  • Optical microscopy
  • FTIR microscope
  • X-ray fluorescence analysis (XRF)
  • Multi-element analysis (ICP-OES)
  • Residual contamination analysis in accordance with VDA 19
  • Microsection preparation
  • Chemical testing
  • Solderability testing
  • Coulometric coating thickness measurement
  • Thermal analysis (DSC)
  • X-ray analysis with CT
  • Compression-tension testing system
  • Chemical opening of components
  • Electrical component testing
  • Mechanical and optical measurement
  • Electrical and mechanical calibration

A sampling of our analysis methods and laboratory equipment:


Minute forces can be created and measured with our compression-tension testing system.

Our 2D X-ray equipment recognizes differences smaller than 1 micrometer and performs mechanical measurements on the samples within the specified micrometer range.

Contamination measurement of PCBs is implemented for new suppliers but also in the scope of routine qualifications and for quality control inspection of our placed assemblies.

With the aid of microscopy, we can view samples and their structures at up to 1500 x magnification and simultaneously capture images.

In addition to determining material composition, coating thickness measurement can also be performed with X-ray fluorescence analysis.

Testing the solderability of almost any component design qualitatively and quantitatively, in accordance with applicable standards and under near serial production conditions, is possible with our solder test system.

Samples can be measured with very high precision, in the single digit micrometer range, with the aid of mechanical optical measuring machines.

Over 4,000 pieces of mechanical test equipment have been calibrated in our climate-controlled metrology room.

Two grinding and polishing machines and a complete system for vacuum pressure embedding have been installed for microsection preparation.

Myriad analyses are performed in our chemical laboratory, such as for fill level determination in plastic granulate and surface testing for chemical resistance. 

With our ICP-OES multi-element analysis system, samples can be analyzed down to their elementary component parts and trace elements.

Coulometric coating thickness measurement helps to guarantee that solder joints durably maintain their mechanical and electrical properties over the course of many years.

Environmental simulations, which serve to safeguard our high level of quality, are able to simulate a wide variety of environmental influences.

Temperature fluctuation testing and moisture testing is performed in climate cabinets (-70 to +180 degrees C).

Mechanical stress can be simulated at Zollner with shock and vibration testing.

Fine dust is dispersed on the product with compressed air in a test chamber. Penetrating particles can be identified and assessed with the dust test.

A product’s corrosion resistance can be examined with the aid of salt spray mist testing.

Splash water testing examines the watertightness of casings in particular.